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January 1999

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Subject:
From:
Scott Mcanall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 15 Jan 1999 18:47:12 EST
Content-Type:
text/plain
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text/plain (48 lines)
Well...I must admit that I am partial to our Unit.

RPS 6sigma.  Micro wetting balance tester.

1.  I could give you a whole list.

2.  The idea behind wetting balnce testing is that the subjectivity of the old
dip and look test is avoided.  The WBT measures the capillary action of the
solder wetting to the lead.  It is not a perfect test, but when done on a
system setup and calibrated properly. The results become very repeatable, but
unless you work with the systems everyday, people still look at it as a
"mysterious Black box" and have trouble believing the results.  As components
have changed the WBT has tried to change along with it.
Dealing with minute parts, not fully metalized leads all have affected the WBT
and the companies that still make WBT's have adapted.
Bottom line is that the tester must be able to repeat a standard calibration
test that emulates the actual test.  This verifies the the WBT has the
capability to test with repeatability

3.  Robotic Process Systems, Malcom, and Multicore are the players that are
working with the industry standards people.

4.  You now have the delimma of the 90's  in the old days it was simpler
Milspec 202 meth.208, DOD2000, ect all spelled out exactly what was
"solderability testing", the ANSI Spec's rely on idea that one persons
solderability is the same as someone else.  They are more agree'ed to
guidelines.

5.  WBT's can help with things like paste testing, flux testing, precleaning,
and other process variables.  Maybe changing flux types or precleaning or
tumbling the parts may help.  WBT can show you the affects of the changes.

Scott McAnall
RPS
www.rpstest.com

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