Dear TechNeters,
On behalf of the International Microelectronics and Packaging Society
(IMAPS) Rocky Mountain Chapter, I would like to invite you to our upcoming
Fall 1998 Technical Joint IMAPS/SMTA Meeting.
The meeting theme is:
"High Density Interconnect"
DATE: 21 January 1999
MEETING THEME: High Density Interconnect
SPONSOR: Circuit Images, John Pawlowski
MEETING CHAIR: Chuck Bauer, TechLead Corporation
LOCATION: Regal Harvest House, Century Room
1345 28th Street
Boulder, CO 80302
COST: $20 IMAPS/SMTA members, $25 nonmembers, $5 Students ( Continental
Breakfast & Lunch Included )
10:00 a.m. Registration
10:30 a.m. - 11:50 a.m. Morning Presentations
10:30 AM Yutaka Taguchi, Matsushita Electric Industries (Japan)
"High Frequency Electrical Characterization
Up to the GHz Range of a MicroCSP Using Chip on ALIVH Technology"
11:05 AM Greg Caswell, Xetel, "CSP Challenges in Contract Assembly"
{Includes high speed CSP placement and assembly video.}
11:50 AM Lunch
1:00 p.m. - 4:20 p.m. Afternoon Presentations
1:00 PM Vern Solberg, Tessera, "PWB Assembly Requirements for Chip Size and
Chip Scale BGAs"
{Includes CSP solder joint reflow video.}
1:45 PM Brian McDermott, MicroVia Inc., "Photo Defined MicroVias for CSPs"
2:25 PM Break
3:00 PM Mike Fitts, The Solution Fitts
"Designing High Density PWB Assemblies; Double Sided, UFP,
BGA, CSP & Beyond"
3:40 PM Scott Popelar, IC Interconnect, "A Flip Chip Reliability Model
Applied to BGA and CSP Solder Joints"
4:20 PM No Host Reception
5:30 PM Speaker Dinner
If you have any questions or comments please feel free to contact me.
Thank you,
Brian C. Hunter, IMAPS Secretary
Storage Technology Corporation
2270 South 88th Street, MS 9152
Louisville, CO 80028
Phone: 303-661-5756
Note: If you are interested in joining IMAPS, you can e-mail me for an
application or sign up on line at www.imaps.org <http://www.imaps.org>
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