You might contact Harry Wachob at Exponent Failure Analysis... tel#
(650) 688-7080

> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
>
>


-----Original Message-----
From: Maguire, James F [mailto:[log in to unmask]]
Sent: Wednesday, January 13, 1999 4:22 PM
To: [log in to unmask]
Subject: [TN] Dye Penetration Testing of BGA solder joints


As part of our BGA reliability testing we would like to perform dye
penetration testing of some of our BGA solder joints (typically after
they've seen vibration and/or thermal stress tests.)

I've seen references to dye penetration tests being done (and even
photo's of joints); what I am looking for is a reference to a person
that actually has done this.  We've tried and frankly are having
difficulties (with plastic BGAs) "popping off" the BGA to look at the
solder joint.  Typically, we tend to fail at the interface between the
substrate (sometimes the PWB, sometimes the interposer) and the pad
rather than in the solder joint.  Now this happens EVEN on parts that
have gone through extensive life testing (thermal cycle/shock) and gone
"open".  We've cross sectioned some parts and the solder joints (many of
them) are in fact cracked.

I have a feeling there is a "technique" to this and I want to talk first
hand with a person that's "got the touch".

Thanks for your assistance.

--------------------------------------------------------
Jim Maguire
Boeing Phantom Works
E/E M&P
Phone (253)657-9063
Fax (253)657-8903
email:  [log in to unmask]
---------------------------------------------------------
---------------------------------------------------------
Jim Maguire
Boeing Phantom Works
E/E M&P
(253)657-9063
email:  [log in to unmask]
---------------------------------------------------------

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