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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 14 Jan 1999 13:14:01 -0800 |
Content-Type: | text/plain |
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Donnn,
Donnn,
To add my experience of working with OSP (Entek Plus 106A),
you never get 100% hole-fill with wavesoldering process. You
get a better result with Organic flux (Water-soluble flux) since
they are more active. I suggest you contact Enthone, Kester,
Alpha-metal and/or other flux mfg. Most flux mfg's have
no-clean flux formulated especially for OSP coated boards.
OSP formulated no-clean flux is more active and give a better
result filling holes. Since you are working with IPC Class 3, it is
more hassle with unfilled hole, I am happy with 75% hole fill.
regards
Matthew Park
NII-Norsat International Inc.
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