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January 1999

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Subject:
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Jan 1999 13:14:01 -0800
Content-Type:
text/plain
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Donnn,
Donnn,

To add my experience of working with OSP (Entek Plus 106A),
you never get 100% hole-fill with wavesoldering process.   You
get a better result with Organic flux (Water-soluble flux) since
they are more active.  I suggest you contact Enthone, Kester,
Alpha-metal and/or other flux mfg.  Most flux mfg's have
no-clean flux formulated especially for OSP coated boards.

OSP formulated no-clean flux is more active and give a better
result filling holes.  Since you are working with IPC Class 3, it is
more hassle with unfilled hole,  I am happy with 75% hole fill.

regards
Matthew Park
NII-Norsat International Inc.

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