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January 1999

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Subject:
SOIC solder joint integrity
From:
Jerry Hoppke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 4 Jan 1999 14:17:30 -0600
Content-Type:
text/plain
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text/plain (22 lines) 
We are trying to evaluate our SOIC solder joint strength/integrity with
no clean flux to process values prior to no clean. I am looking for
guidance on testing values and procedures. If anyone has any
information, history, suggestions I would be interested.

Thank You
Jerry Hoppke
Quality Engineering
Datakey

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