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January 1999

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Subject:
From:
Don E Steffen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Jan 1999 12:27:55 -0500
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     Hi all!

     Is there anyone out there that has experience on the use of No Clean
     Solder Paste and Flux?

     I am having a problem with organic coated boards, in that the time
     period between reflow oven and the wave solder appears to be a big
     problem. I can not get good reflow to the top side of through
     components in order to meet the requirements of IPC Class III. I am
     told by board manufacturers that I should be able to wait up to 12
     hours between reflow and wavesolder. The organic coating we are using
     is ENTEK PLUS made by Enthone.

     What am I doing wrong?

     Is organic coating degradation directly proportional to reflow
     temperature?

     Is there anyone out there that has data on a DOE that I can get a hold
     of?

     Maybe the flux I am using is inadequate, without any sales pitch, what
     is a good No Clean Flux that someone has experience with that is
     capatible with Organic Coated boards? I am presently using Alpha
     NR310B!

     What is an acceptable solder pot temperature for the use of Organic
     Coated boards?

     Signed

     I Need Help

     Donn Steffen/VDO Control Systems

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