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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 14 Jan 1999 12:27:55 -0500 |
Content-Type: | text/plain |
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Hi all!
Is there anyone out there that has experience on the use of No Clean
Solder Paste and Flux?
I am having a problem with organic coated boards, in that the time
period between reflow oven and the wave solder appears to be a big
problem. I can not get good reflow to the top side of through
components in order to meet the requirements of IPC Class III. I am
told by board manufacturers that I should be able to wait up to 12
hours between reflow and wavesolder. The organic coating we are using
is ENTEK PLUS made by Enthone.
What am I doing wrong?
Is organic coating degradation directly proportional to reflow
temperature?
Is there anyone out there that has data on a DOE that I can get a hold
of?
Maybe the flux I am using is inadequate, without any sales pitch, what
is a good No Clean Flux that someone has experience with that is
capatible with Organic Coated boards? I am presently using Alpha
NR310B!
What is an acceptable solder pot temperature for the use of Organic
Coated boards?
Signed
I Need Help
Donn Steffen/VDO Control Systems
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