Dear TechNetters,
        I have a fairly simple problem that I am looking for advice on.
We use no-clean solder paste.  How do some of you clean mis-printed
boards with no-clean paste?  How do you insure you get all of the paste
out of the vias?  If it is a double side reflow board and the first side
is already populated, how do you clean mis-prints on side two and insure
that paste from vias underneath large QFPs is completely removed?  If
you use certain chemicals and/or ultrasonic agitation, are there
specific SMT components that are damaged by the use of these techniques?

Thanks in advance for your replys.

Wade Oberle
Sr. Mfg. Engineer
Manutronics, Inc.
[log in to unmask]

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