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January 1999

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Jan 1999 08:16:21 -0600
Content-Type:
text/plain
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text/plain (74 lines)
Jay,
        If you are having problems with fiducial recignition of a pad
vs. a square fiducial, a cross might help but a solid round would be
best to prevent incorrect recognition. Also, tighten up the vision
system search window as close as possible to the outline of the fiducial
to minimize it picking up adjacent markings.

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Jay Bitanga [SMTP:[log in to unmask]]
> Sent: Thursday, January 14, 1999 3:10 AM
> To:   [log in to unmask]
> Subject:      [TN] BGA Substrate
>
> Hi Everyone,
>
> I would like to ask your opinions regarding our problem with our BGA
> board.  You see, a problem occured during our placement of
> components, specifically 0402 comps,  on the substrate. Because of
> the density of the circuit, a test point is mistakenly registered as
> a fiducial mark since it is vey close to the latter.  The fiducial is
> square  solid shaped (15 mils).  We considered that the shape of
> the fiducial is the factor involved in the registration error so what
> we did was change the shape of the fiducial but adapted the same
> measurement of it (cross-hair).  Is this possible ???  Are there also
> problems that we do not see ???  Are there standards available  for
> substrates for BGA and other types of new technologies ???
>
> Thank you very much for taking time in answering these questions.
> Any information is much appreciated.
>
>
>
> Regards,
>
> Jay Bitanga
> Electronic Assemblies Inc.
> [log in to unmask]
>
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