Hi Everyone,

I would like to ask your opinions regarding our problem with our BGA
board.  You see, a problem occured during our placement of
components, specifically 0402 comps,  on the substrate. Because of
the density of the circuit, a test point is mistakenly registered as
a fiducial mark since it is vey close to the latter.  The fiducial is
square  solid shaped (15 mils).  We considered that the shape of
the fiducial is the factor involved in the registration error so what
we did was change the shape of the fiducial but adapted the same
measurement of it (cross-hair).  Is this possible ???  Are there also
problems that we do not see ???  Are there standards available  for
substrates for BGA and other types of new technologies ???

Thank you very much for taking time in answering these questions.
Any information is much appreciated.



Regards,

Jay Bitanga
Electronic Assemblies Inc.
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################