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January 1999

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From:
"Maguire, James F" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Jan 1999 16:21:56 -0800
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As part of our BGA reliability testing we would like to perform dye penetration testing of some of our BGA solder joints (typically after they've seen vibration and/or thermal stress tests.)

I've seen references to dye penetration tests being done (and even photo's of joints); what I am looking for is a reference to a person that actually has done this.  We've tried and frankly are having difficulties (with plastic BGAs) "popping off" the BGA to look at the solder joint.  Typically, we tend to fail at the interface between the substrate (sometimes the PWB, sometimes the interposer) and the pad rather than in the solder joint.  Now this happens EVEN on parts that have gone through extensive life testing (thermal cycle/shock) and gone "open".  We've cross sectioned some parts and the solder joints (many of them) are in fact cracked.

I have a feeling there is a "technique" to this and I want to talk first hand with a person that's "got the touch".

Thanks for your assistance.

--------------------------------------------------------
Jim Maguire
Boeing Phantom Works
E/E M&P
Phone (253)657-9063
Fax (253)657-8903
email:  [log in to unmask]
---------------------------------------------------------
---------------------------------------------------------
Jim Maguire
Boeing Phantom Works
E/E M&P
(253)657-9063
email:  [log in to unmask]
---------------------------------------------------------

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