We are getting into doing BGA's. Just a 27 by 27 overall dimension
component, with pitch of 1.27 with 20 rows & columns, with balls. Not a
complex part by any means. Our IC placement machine picks up, recognizes
and places great. Been told that since the part is spec'ed out to be with
balls, that it is either a hand place deal with a special machine or use
glue dots on the masking of the PCB, to hold the component in place during
reflow. No solder paste using a screen printer required.

My questions are does anyone use solder paste and a screen to place BGA's
with or without balls?   Where should the thermocouples be placed to get
the proper reflow profile?

Thanks in advanced.

John Chandler
ITRON
2818 N. Sullivan Road
P.O. Box 15288
Spokane, WA 99215
[log in to unmask]
Voice (509) 891-3343
 Fax   (509) 891-3355

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