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January 1999

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Jan 1999 15:10:04 -0600
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text/plain (73 lines)
Martha,
        You're not trying to whack the competition, are you? (hehehe).
The Teka connectors have a solid solder deposit that is carefully
matched to the pin/hole diameters to provide the right amount of solder
without excess. At reflow, the surface tension keeps it at the
connection and prevents it from wicking further down the pin.

Steve,
        Did you check Teka's web site yet? They also have a hot air
fountain (from Zephyrtronics, the ChipQuik folks) specifically designed
for the PC104 connector that works great, and eliminates the problems of
them long 'ol pins dangling down during reflow. It's worth the cost if
you're going to be doing much of the PC104 style.

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Rupert, Martha L. [SMTP:[log in to unmask]]
> Sent: Wednesday, January 13, 1999 2:23 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Assy:Through-hole Solder Preforms...
>
> I may be misinterpreting this requirement, but if the reason for the
> "long"
> gold pins sticking through the board is to mate to "something else" on
> that
> particular side (opposite the receptacle side) of the board (that's
> why your
> hand soldering effort worked and you didn't get "a pimple" of solder
> on the
> pins), how are you going to prevent the solder from the donuts wicking
> down
> the pins (onto the gold) during your reflow process and contaminating
> the
> "mating interface"?
>
> Martha Rupert
> AMP Incorporated
>
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