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January 1999

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Subject:
From:
MaryEllen Hilderbrand <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Jan 1999 14:48:27 -0600
Content-Type:
text/plain
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text/plain (199 lines)
CALL FOR PAPERS
Fifth Annual IPC National Conference: 
Flexible Circuits '99
Meeting the Challenge of the 
Next Generation of Packaging
June 8, 1999: Workshops
June 9-10, 1999: Technical Conference and Tabletop Exhibits 
Holiday Inn Denver International Airport
Denver, Colorado

Participate in the electronic interconnection industry's most important forum
dedicated exclusively to flex circuitry. The first four IPC National Conferences on
Flexible Circuits were a tremendous success, together drawing over 700 industry
representatives from across the United States and world. This event is truly an
opportunity to learn and contribute to the industry. This year, IPC will provide even
more reasons to attend -- with one-day workshops on June 8th and tabletop exhibits to
complement the technical conference on June 9th and 10th.

Papers for the technical conference are sought in all areas including:

  · New Product Applications
· National and World Market Trends
· Design Strategies for Flex
· Material Alternatives
· Processing Innovations
· Fine Line Flex¯Increasing Interconnect Density
· Flex Assembly
· Fine Pitch and High Density Packaging for Flex
· Reliability and Testing Data

The two-day IPC 1999 National Conference on Flexible Circuits offers time slots
between 30 minutes and one hour. Some papers may be grouped together in a forum or
panel discussion. 

To submit an abstract, please send the information requested below and include an
abstract of 200-300 words along with a brief biography via e-mail to
[log in to unmask] or fax: 847-509-9798. The deadline for abstract submission is March
1, 1999.

Presentation materials and papers must be non-commercial in nature, focusing on
technology rather than a company's product. It is mandatory to provide a
print-quality paper or hard copies of visuals for the conference proceedings in order
to deliver an oral presentation. The deadline for paper submission is May 15, 1999.

Presenters at the IPC National Conference on Flexible Circuits will receive full
conference admission, including refreshments, lunches, and the proceedings at no
charge. The technical conference registration fee will be $395 for IPC members and
$495 for non-members.

For information on or an application for a tabletop exhibit, please contact John
Riley at 847/790-5308. The fee for a tabletop exhibit is $550 for IPC member
companies and $750 for non-members and includes an admission for one person to the
technical conference.
----------------------------------------------------------------------Proposed
Presentation Form
IPC National Conference: Flexible Circuits '99

Complete and mail, fax or e-mail this form with your biography and abstract to:

John Riley, Director of Education
IPC
2215 Sanders Rd.
Northbrook, IL 60062-6135
Fax: (847) 509-9798/E-mail: [log in to unmask]


Name________________________________________

Company_____________________________________

Title_________________________________________

Street Address________________________________

City__________________ State/Zip________________

Phone_________________Fax___________________

E-mail_________________________________

On a separate page, please include your 200-300 word abstract describing the
presentation you wish to have considered for the IPC National Conference: Flexible
Circuits '99.

Presentation Title:____________________________________________

Presentation Slot Desired:  (circle one)
             30 minutes 45 minutes  One hour

Indicate the general area of flexible circuit technology:

Design
Fabrication
Assembly
Materials
Market
Applications
Other ______________________________________

Has this paper been presented before? (circle one) Yes  No

If yes, when and where? ___________________________________________________

  · Send Proposal prior to March 1, 1999
· Paper Submission due before May 15, 1999
· Reminder: This Call for Papers, as well as the Call for Papers for both our
Electrical Test Conference and Chip Scale/BGA Conferences are available from our
website www.ipc.org.


Maryellen Hilderbrand
Education Manager
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Phone: 847.790.5382
Fax: 847.509.9798
E-mail: [log in to unmask]
URL: http://www.ipc.org
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     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