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January 1999

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Subject:
From:
"Rupert, Martha L." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Jan 1999 15:22:48 -0500
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text/plain (23 lines)
I may be misinterpreting this requirement, but if the reason for the "long"
gold pins sticking through the board is to mate to "something else" on that
particular side (opposite the receptacle side) of the board (that's why your
hand soldering effort worked and you didn't get "a pimple" of solder on the
pins), how are you going to prevent the solder from the donuts wicking down
the pins (onto the gold) during your reflow process and contaminating the
"mating interface"?

Martha Rupert
AMP Incorporated

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