Hi Steve,

        One possibility is to increase the ground and/or power planes copper
thickness. If at all possible make the board of a balanced construction to
prevent warpage. An alternative would be to use 6 - 10 mil Copper/Invar/Copper
(CIC)for the ground or power planes (again keep it balanced). Should you do
either of these, a move to a Hi-rel or Hi-Tg Epoxy would offer much better
adhesion to either the copper or CIC. Of course there are many more options. It
will be interesting to see what others in the Forum propose.

Regards,
Les
>  From: [log in to unmask], on 1/5/99 9:50 AM:
>  David Jandzinski asked:
>  "What is the PWB laminate material?"
>
>  The current material is polyimide, but we are lucky enough to be at a point
>  where a redesign of the PWB is possible.  This would allow us to change
>  board
>  laminate materials if advantageous.
>
>  I have asked about a more compliant adhesive, but the engineers are
>  concerned
>  about mechanical rigidity which may be effected by such an adhesive.  Not
>  much
>  on board design, so I couldn't really argue the point....
>
>  Thanks again!
>
>  Steve
>
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