TECHNET Archives

January 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ryan Jennens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 12 Jan 1999 17:15:24 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Hey everybody!

I was asked about any problems that would be associated with having a
plastic casing injection molded around an assembled PCB. I am not sure if
injection molded plastic has to be hot, I am assuming so (can they use
epoxies?). If they use hot plastic, I beleive there would be an issue with
the speed at which the parts would be heated. Wouldn't they be heated faster
than the max recommended ramp rate (4 deg/sec)? There might also be issues
with the different CTEs of board and parts. Can you pre-heat assembled PCBs
before the casing is applied? Are there any other issues? Is anybody doing
this? I am sure I will need to supply more info, just let me know what it
is. Thanks, gang!


Ryan Jennens
Phoenix Engineering Design, Inc.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2