You have strayed into the world of R/F "black magic" engineering of the old variety. Kelly and
I, among others, have talked about this before, but regarding supposedly needed vias in SMT
pads for optimum electrical performance.

It is a servious problem there and and everywhere employed. I have never found a way to get
the heat out this way, nor have I ever been able to effectively solder anything with
acceptable solder joints doing this. Micro-vias are and exception when blind and the process
is effectively managed to avoid outgassing problems.

There is no way I know to reflow solder leads this way. Hand soldering provides only
frustration watching the solder go down the tubes while watching pads lift.

At least that's been my experience while sharing it with so many others. Also, getting the
heat out this way is not the most effective - as you already have stated and know.

Good luck Mary,

Earl Moon

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