TECHNET Archives

January 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 12 Jan 1999 13:24:45 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
It sounds like the same story over again begining for me in the 60's (Jesus Christ - that long
ago). Nothing ever changes concerning TCE mis-matches. The epoxy expands way out of proportion
to ceramic, at least it used to. Obviously, this is done during reflow and other thermal
cycling with no fault pointed at the cleaning process.

We, then and much later, went to glass to metal seals. Then, they were Kovar glass to metal
seals with nearly matching thermal characteristics providing high degrees of hermetic sealing.
Later was in the 70's and 80's. Don't know what "modern" hybrid folks are doing now but,
again, the problems are the same.

Earl Moon

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2