Tom,

We do this millions of times of year and although the spacing is antiquated, it is still well supported so
you may want to consider it.

                0-------------
                                    |
                0            0.100"
                                    |
                0            0.100"


Take a TO-92 package and spread the outer legs out 0.200" from each other and run it perpinducular through
the wave.

I can't give you the wave solder pad style as it is a closely guarded secret.  Ok enuff infomerciall.

For Just $29.95 no wait 19.95 hold that thought! Mr. Pope Pail (saves me from law suits) is high on
something and said give it away for free!  NHot only do you get a dice a matic you also get a winning
solution!

Make your pads ovaluar with the pad at 64X100.  This is about the minimum for single sided punch and
crunch.  If you are double sided then you can go 60X100.  The nice thing about this is you increase the
distance between pads so dendrite growth has to go farther to cause problems.

try someting like this.



                ___    50 mil track next to the outer pad
                  0

                  0

                  0
               -----   50 mil track next to pad


IF you need more information let me know.


Mark Ross


Tom Braswell wrote:

> Netters,
>
> It's Tom again,  thanks for feed back on DIP IC orientation, now how about
> TO-92 orientation
>
> 1.  Direction thru wave -------------->
>
>                 O
>                     O
>                 O
>
> 2. DTW ----------------->
>
>                     O
>                 O
>                     O
>
> 3. DTW --------------->
>
>                 O O O
>
> 4. DTW --------------->
>
>                     O
>                     O
>                     O
>
> I have listen to others in my company, some say one way others say another.
> I want to know who to listen to and who not to listen to.
>
> Also is there any good books or Web sites that detail designing
> for wave soldering.
>
> Bare with me!
>
> Tom B.
>
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