TECHNET Archives

January 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
David Jandzinski <[log in to unmask]>
Reply To:
Date:
Tue, 5 Jan 1999 08:17:49 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (71 lines)
Steve

What is the PWB laminate material?  This will determine what possibilities
exist for stiffening materials.

The possible candidates would be

Laminate
Cu
Different laminate structures
Adhesives that will absorb some of the CTE differences
CIC

Send the laminate type that you are using now, I may be help you further.

David Jandzinski
Substrate Product Engineer
Abpac, Incorporated
-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent:   Tuesday, January 05, 1999 12:45 AM
To:     [log in to unmask]
Subject:        [TN] Methods for Stiffening a PWB

All,

We have a current PWB assembly that uses an aluminum stiffener bonded to one
surface for mechanical reasons.  The problem with this is that during
extreme
thermal excursions (as required by the operating environment of the
assembly)
the assembly flexes a great deal due to the expansion mismatch.  Luckily, we
may
have to opportunity to do a re-design of the assembly and move to some
different
method of stiffening.  Our experiences in this subject are very limited, and
would greatly appreciate any options for stiffening a PWB from a board
design
standpoint (i.e.-some type of cored board, other materials either PWB or
stiffener, etc.).

Thanks in advance for your help.

Steve McBride

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2