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January 1999

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Subject:
Re: Orietation of DIP IC for Solder Wave
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 11 Jan 1999 15:52:21 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (59 lines) 
Tom,
M.F. Comerford, Hollis Engineering, wrote a paper titled "Influence of Circuit Layout and Lead Configuation
on the Soldering of Printed Wiring Assemblies", around 1979 or 1980, that addresses your concern.  This
paper addressed creation of solder bridges due to the orientation of ICs and pad design.   His conclusions
state "Bridges occured 3 to 10 times as frequently on ICs oriented perpendicular to the line of travel",
your option 2.

Gary Camac

Tom Braswell wrote:

> Netters,
>
> Someone tell me which of these two is correct for wave soldering
>
> 1.       Direction thru wave -------------------->
>
>                     _|__|__|__|__|__
>                     |                           |
>                     |                           |
>                     |____________|
>                       |    |     |     |    |
>
> 2.  Direction thru Wave ----------------------->
>
>                      _______
>                 __|               |__
>                 __|               |__
>                 __|               |__
>                 __|               |__
>                     |_______|
>
> Thanks,
>
> Tom B.
>
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