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January 1999

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Subject:
From:
Thomas Burek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Jan 1999 15:31:58 -0500
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Good day Technet,
May I pose a question of screen thickness in regards to a surface mount fine pitch part.  I have a surface mount PCA that is using a 100 pin, 20 mil.  spacing TQFP.   What is the ideal thickness of the screen I should specify that is not going to put down too much solder paste, thereby preventing bridging between pads?   Also, I have been reading a lot on this forum about immersion white tin.   It sounds as though many of you feel this is a good finish to use with fine pitch parts.   Normally I use gold flash, but this sounds as good or better if the cost is not higher.   Where can I find these archives at www.IPC.org so that I may review the consensus?  I searched the site but could not find any link to archives.
Thank You,
Tom Burek
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