Hello!
We are wave soldering through hole coils-the molded type-and experienced
a new problem -for us.
They fail during electrical test, regain their properties-eventually-
after applying pressure on the top of the component, or after
resoldering ,or after
desoldering.
The original solder connections are perfect-checked by cross sectioning
of the mounted component on the circuit.
The sectioned component shows bubbles in the molding and  fine cracks
in the area of coil wire soldering to the leads.
Is somebody there who experienced the same problem?
POPCORNING????
Thanks,
Gaby

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