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January 1999

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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 5 Jan 1999 14:57:32 -0600
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, nishath yasmeen <[log in to unmask]>
Subject:
Porous copper deposits
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Texas Instruments
From:
nishath yasmeen <[log in to unmask]>
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text/plain (19 lines) 
Hello everyone! I have a question about the effect of agitation in acid
copper plating tanks. Why is the copper very porous and burnt when there
is no agitation in the tank? What actually causes the copper to be
porous?
Thanks in advance,
Yasmeen

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