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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 22 Jan 1999 13:27:42 +0700 |
Content-Type: | text/plain |
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Dear Sir,
Refer to ANSI/J-STD-004 in detail of IPC-TM-650 Test Method No.
2.6.3.3 Surface insulation Resistance,Fluxes. I would like to ask
you the following question:
1. Is this procedure can use for PCBA( Use actual PCBA after assy
as the sample board) because I understand that Test Method No.
2.6.3.3 use for identify effect of flux by SIR test and we
must prepare the specimen by flux which we want to test, But we
would like to test our PCBA(finish good) Can use this procedure
or not? Or have other specific method for SIR test of residue on
PCBA?
2. We can use the following item for test all type& dimension of
sample(PCBA) ? :
- test condition(humidity,temperature)
- test pattern size
- other parameter
Please answer my question and thank you for your response.
Best Regards,
Patranit
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