Every morning, after adjusting of chemicals, we run a 1"x1" pure teflon
which is sodium etched dummy from the PTH line. The last step of the PTH
line is 30 min of electroless copper plating. Every morning, the dummy
reads a copper thickness of 60-70 u in. However after running about 3-4
hours of real production panels in the same PTH line, the copper thickness
measured dropped to 25-30 u in. We make addition of chemicals every 2 hours.
I am just curious to know why. There are no PTH voids. Just copper thickness
is low.
Can any one help.
My e-mail : [log in to unmask]
Thanks!!!!!!!
Francis
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