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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 29 Jan 1999 11:49:51 -0700 |
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Our immersion gold process plates electroless nickel 100-200 microinches and
gold 2-8 microinches. Any increase in the gold thickness (greater than ten
microinches) causes problems in the nickel layer. In our process, the
palladium is used to activate the copper surface before nickel plating
(electroless nickel, 6-8%P), but we do plate any palladium after nickel.
Jodi Eitner
Process Engineer (Immersion Gold, Entek, Tab Plate, HAL)
Compeq International
Salt Lake City, UT
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