I just found out that I can replace a $120 LTCC substrate with a $1.95
microvia PCB. Trouble is the PCB comes with nickel/flash gold so cannot be
wire bonded using our gold ball bonding equipment. Evidently it can be
bonded using ultrasonic aluminum wedge. This MCM has over 700 wires in a
1.5"x1.5" area (one of the ASIC's has 220 wires itself)- military
application.
Does anyone have experience with al. wedge on such boards? Construction is
175C Tg FR4 core with 3 layers of photovia on top (photoimageable epoxy
plated up with copper). Will it work? Who makes the best bonder?
Phil Hersey, Hytek Microsystems
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