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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 19 Jan 1999 16:33:11 -0500 |
Content-Type: | text/plain |
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We have been seeing boards come off our reflow oven with bow and twist
that exceeds IPC specs. Our vendor insists that we are the only
customer that complains about this. We had our reflow oven calibrated
and it looked fine. The only thing about the profile that may be
suspect is the cooling rate may be a little too fast. According to the
vendor, they put all of their boards through a de-warping process.
The vendor has tweaked their de-warping process to cool slower in an
effort to make the problem go away.
My question is: This is our first bout with warping, what should we be
looking at for a cause? Is it normal for a pc board vendor to have to
de-warp boards?
Regards,
Ken Nevius
Veeder-Root
Altoona, Pennsylvania
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