IPC-9502
PWB Assembly Soldering Process Guideline for Electronic Components

This document describes manufacturing solder process limits that components subjected
to IPC-9501, IPC-9504 and J-STD-020 would survive.  It does not include optimum
conditions for assembly, but rather guides to assure components are not damaged.
This document applies to both surface-mount (SM) and through-hole (TH) components
that are wave soldered, reflowed or hand soldered.  This document is intended to
complement other industry documents.  Note: This document does not address the
increased temperature requirements of lead-free solders.  28 pages.  Released April
1999.

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