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Tue, 18 May 1999 16:10:52 -0500 |
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Chip Scale and BGA National Symposium Proceedings
The proceedings from the National Symposium May 5-7, 1999 in Santa Clara, California.
Presents new substrate technology, water level processes, PCB design strategies,
assembly and reliability data. Critical issues, such as package design for test and
BGA solder joint reliability are covered. Volume 1/183 pages. Volume 2/96 pages.
Released May 1999.
IPC Members: $50 Nonmembers: $100
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