I'm looking for a ground pad design the has the following
     characteristics:

     -  Annular ring of copper broken to prevent solder over.  Does not
        require masking to prevent solder over during wave solder
        operations.

     -  Has sufficient pad area to allow chassis grounding through metal
        standoffs.  Must have copper around hole to allow shoulder of metal
        standoff to contact to create ground path.

     -  Design eliminates need for plated through hole on double sided and
        multi-layer boards.  Assume use of multiple solder vias around hole
        to connect various board layers.

     If anyone has a proven design for a ground pad meeting these
     characteristics, please let me know.

     Thanks,

     Dave Hamilton
     UT Electronic Controls
     [log in to unmask]

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