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December 1998

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Subject:
Solvent for Underfills
From:
Manish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 Dec 1998 15:13:38 -0500
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (26 lines) 
Hi Everybody

Is anyone aware of any solvents that may be used to dissolve the cured
encapsulants.  We often receive field failures (flip chip on flex) and for
some FA purposes we intend to dissolve the encapsulant.  We tried a
solvent J100 which works good with most of the encapsulants except for
Zymet.

Has anyone ever had any luck with zymet.  Any responses would be highly
appreciated.

Regards
Manish

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