Chi,

Do you really want to unecessarily stress the solder connections like that?  It can lead to pre-mature
field failures.

However this may depend on the type of IC.  Is it DIP, TO-220, TO92, SMT SOIC etc.  If the force is applied
parallel to the solder connection this may put force on the solder connection and cause premature
failures.  You may want to check and see if there are any guidelines for this and it may be material
related also.  For Example, ok to do on FR-4 Material but not CEM-1 as it flexes more.  Let me know how it
turns out!

Mark Ross
Sr. Design Engineer
Whistler Auto-Mation Products Inc.


Chi Wong wrote:

> Hi,
>
> We have several applications of attaching heatsinks to IC's at our plant and
> currently it seems that the easiest method is to use a double sided thermal
> tape.  We are currently applying the tape manually and using hot air guns to
> heat up the surfaces and tape to decrease the pressure and time required for
> the adhesive to set.  However, we are searching for a more reliable and
> consistent automated method for attaching the heatsink to the IC's without
> putting the solder joints in jeopardy.
>
> Does anyone know of any press manufacturers that may carry something for
> this type of application?  We are talking about 30 psi at room temp for 5
> sec or 10 psi at 50-65 deg C for 5 sec.  Does anyone know of a better
> process besides thermal tape?
>
> Any feedback is appreciated.  Thanks.
>
> Chi Wong
> Process Manufacturing Engineer
> [log in to unmask]
>
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