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December 1998

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Subject:
From:
Achim Neu <[log in to unmask]>
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Date:
Wed, 30 Dec 1998 00:27:08 +0100
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We are actually in the situation that we want to start the solderball
apply with an microBGA flextape package and we seen some problems with
the ball surface (SnPbAg alloy) after reflow. It looks rough and matt
visually.
Does anyone know or has proposal what kind of flux is usally used for
solderball apply to a gold plated copper via pad for sollball reflow ?

Any information s welcome.

Achim

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