Teik,

Please understand that only the UV lasers can drill thru the copper on the
surface of RCC.  Then, the laser intensity must be changed so that the same
power setting does not also drill thru the capture pad.  CO2 lasers need to
have the copper opened with conventional etching technology but easily stop at
the capture pad.  There are new combination lasers coming onto the market
which combine UV to open the copper and CO2 to remove the dielectric.
However, these are just starting to develop a history in terms of hit rate,
accuracy, machine up-time and so on.

Denny Fritz
MacDermid

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################