Hi,

We have several applications of attaching heatsinks to IC's at our plant and
currently it seems that the easiest method is to use a double sided thermal
tape.  We are currently applying the tape manually and using hot air guns to
heat up the surfaces and tape to decrease the pressure and time required for
the adhesive to set.  However, we are searching for a more reliable and
consistent automated method for attaching the heatsink to the IC's without
putting the solder joints in jeopardy.

Does anyone know of any press manufacturers that may carry something for
this type of application?  We are talking about 30 psi at room temp for 5
sec or 10 psi at 50-65 deg C for 5 sec.  Does anyone know of a better
process besides thermal tape?

Any feedback is appreciated.  Thanks.

Chi Wong
Process Manufacturing Engineer
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