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December 1998

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Subject:
Re: Copper foil evaluation item
From:
"Meigs, Jonathan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Dec 1998 11:20:32 -0700
Content-Type:
text/plain
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text/plain (61 lines) 
Howard,

I will be happy to supply any information regarding copper foil that I
can. I can be reached at;

Jonathan Meigs
Product Development Engineer
AlliedSignal Oak-Mitsui
80 First Street
Hoosick Falls, NY 12090

(518) 686 - 8019

eMail; [log in to unmask]

-----Original Message-----
From: Howard Lin [mailto:[log in to unmask]]
Sent: Monday, December 28, 1998 5:19 AM
To: [log in to unmask]
Subject: [TN] Copper foil evaluation item


Dear All,

Happy New Year to everybody!

My boss assign me to evaluate copper foil for PCB production. But I can
not catch up this critical point to evaluate this important material. I
shall be very appreciate if there is anybody to give me instruction or
any information.


Howard

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