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December 1998

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Date:
Mon, 21 Dec 1998 18:02:04 EST
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Mike,

A thermal relief on inner layers for surface mount connects is still used by
those concerned with field removal of components. The removal process uses a
hot air hood. The heat sinking effects of a straight connection over-rides the
heat transfer of the hot air removal system. Thereby making it difficult if
not impossible to remove the component.

Regards,

Gary Ferrari
Executive Director
IPC Designers Council

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