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December 1998

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Subject:
From:
Matthias Mansfeld <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 21 Dec 1998 18:38:27 +0100
Content-Type:
text/plain
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text/plain (32 lines)
On 21 Dec 98 at 7:29, Mike Bailey wrote:

> We continue to see current designs incorporating via hole
> configurations utilizing "wagon wheel" interconnects to plane
> layers.
I use direct connects whenever no thermal reasons need "wagon wheel"
style. That means, vias (no THT holes) without thermals,
and all thru-holes with leaded components which become hand- or
wave-soldered, with thermals. I can set up this without problems in
my CAD system which type of hole gets spokes or not by default.
Regards
Matthias
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de

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