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December 1998

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Subject:
Nodules in copper plating process
From:
nishath yasmeen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 21 Dec 1998 16:21:15 -0600
Content-Type:
text/plain
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text/plain (22 lines) 
Hello,  We are seeing huge nodules which occur mostly on the edges of
the pattern for our acid copper plating process. The copper in the
resist opening is of the normal height but near the edges it seem to be
about 30ums thicker. Another notable thing is that this happens when the
bath if very fresh i.e just after the anodes are filmed. Is this because
of  a very high field in that region causing the copper to plate very
high. Any suggestions will be appreciated.

Yasmeen

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