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December 1998

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Subject:
From:
"Benjamin G. Thomas" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 21 Dec 1998 12:17:27 -0500
Content-Type:
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text/plain (57 lines)
Mike,
I agree with you; we make all connections to internal layers (except for
through-hole component holes) with direct connections.  The only reason
that I have found to keep the "wagon wheel" (thermal relief) connections
is for identification during the PCB design process.  We keep the
thermal relief connections during the design process, then remove them
just before the PCB is released to the manufacturer.  These thermals
allow us to see where connections are made to the internal planes when
looking at individual layers.
Hope this sheds some light.

Benjamin G. Thomas
OEM Controls Inc.
Shelton CT

-----Original Message-----
From: Mike Bailey [mailto:[log in to unmask]]
Sent: Monday, December 21, 1998 7:29 AM
To: [log in to unmask]
Subject: [TN] Via Configuration


We continue to see current designs incorporating via hole configurations
utilizing "wagon wheel" interconnects to plane layers.  Didn't the
purpose of this design become obsolete unless thru-hole leaded
components
and wave soldering are necessary? Why not simply go with direct
connects?
 Can someone shed some light on this subject?

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