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December 1998

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Subject:
From:
Wade Oberle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 Dec 1998 16:13:53 -0600
Content-Type:
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text/plain (334 lines)
I believe all of the answers are correct in various degrees.  The one
thing that I did not see anyone mention is the amount of each of the two
alloys that are being mixed.  If you know each alloy's composition and
you know each alloys approximate weight, you can calculate their mixed
composition (assuming there are no large percentages of impurities and
that the alloys are above both liquidus temperature and assuming the mix
is given time to reach a homogenous state).  Once the mixed composition
is calculated, the properties of that alloy can be partially evaluated
from the binary phase diagram.  Regarding properties such as elasticity,
resistance to fatigue, etc,  you may get lucky and the combined
composition maybe similar to a 'standard' composition for which there
may be published reliability information.

Best of luck


Wade Oberle
x-materials engineer that changed fields years ago


        -----Original Message-----
        From:   Alderete, Michael [SMTP:[log in to unmask]]
        Sent:   Thursday, December 17, 1998 2:22 PM
        To:     [log in to unmask]
        Subject:        [TN] ASSY: Responses to my Posting:  ASSY:mixing
of high and             low-temp             PbSn alloys

        Below are the responses I received to my question about the
mixing of
        hi-temp and eutectic PbSn solders.

        Thanks to Dave, Bill, Paul, and Andy for their responses,
numbered [1]
        through [4] below; my original question is included at the end
of this
        message.

        After reading the replies, I'm a bit uneasy about allowing these
2
        alloys to mix and reflow in an "uncontrolled" manner. We want to
use the
        hi-temp alloy on this particular joint, so I'll recommend
removal of the
        eutectic preform, and complete the subsequent clip lead
attachment using
        the hi-temp solder (probably Sn10/Pb90, AND NOT 90-94% Sn, as
stated in
        the original posting).

        If anyone else wants to take a stab at explaining what happens
when the
        two alloys mix, please send a posting to TechNet. The 3 days of
mid-80F
        temps we are now experiencing are purely coincidental.

        Best Regards,
        Michael Alderete


        [1] Dave Hillman Wrote...

        -----Original Message-----
        From: David D Hillman
[mailto:[log in to unmask]]
        Sent: Friday, December 04, 1998 9:12 AM
        To: TechNet E-Mail Forum.; Alderete, Michael
        Subject: Re: [TN] ASSY:mixing of high and low-temp PbSn alloys




        Hi Michael! Turkeyday in Iowa was only 70F but we didn't'
complain! The
        answer to your question is pretty simple: you will get a solder
alloy
        which
        lies somewhere between the two alloy compositions you start
with. The
        tin
        content will be in  the 63% - 90% range and you Pb content will
be in
        the
        10%-37% range provided the soldering operation allows for the
normal
        diffusion/mixing mechanisms to take place. Some folks consider
this a
        problem because finding or understanding the reliability
characteristics
        of
        this "new" solder alloy can be difficult. Other folks just
evaluate the
        two
        alloys (the Sn63 and Sn90) for their reliability
characteristics/merits
        and
        if both alloy data sets fit their use environment then they
assume the
        "new" alloy won't cause them any issues. The use/combination of
        different
        solder alloys for solder joints can be a pretty involved topic -
I don't
        know of a lot of published information on the subject. Good
Luck.

        Dave Hillman
        Rockwell Collins
        [log in to unmask]

        ==============================================================


        [2] Bill Kenyon Wrote...

        To: MICHAEL ALDERETE <[log in to unmask]>
        --------------------
        I asked a similar question of the person who is head of all
        soldering operations at Siemens at an ISO soldering materials
        standards meeting. The answer I got was "we don't know what sort
        of material would result, could be really excellent alloy, could
        be very brittle, properties could not vary much over a range or
        could optimize at a very sharp peak (in the phase diagrams)." So
        they were not into mixing different alloys on the PWB, lead
        finish and the joining alloy.

        Too bad some excellent work done about ten years ago was never
        published.
        Experimenter ran designed experiments with alloy compositions,
then
        using a
        mathematical model, generated an Excel spreadsheet where you
plugged in
        the
        basics and got a phase diagram output. Really slick predictive
tool.
        Just
        heard one presentation on it, so may not have all the details
just
        right, but
        the essence is there:
        Run some basic experiments and you can predict the phase diagram
for any
        combination of the alloy components!!
        Experimenter's mgt. never understood the value and put him on
"work with
        a
        real payoff potential" which of course killed it.

        --Bill

        ==============================================================

        [3] Paul Gill Wrote....

        Michael,
                I am a bit behind on my reading so you may already have
the
        answer
        that you are looking for.  But I will give you what I can just
the same.

                During reflow at equillibrium the low temperature solder
will
        melt
        first.  Given sufficient time and temperature and the high
temperature
        solder will be dissolved into the liquid.

                Grab yourself a binairy phase diagram for the alloys
that you
        are
        looking into.  Assuming that your system is only lead and tin
then you
        have a simple eutectic situation.  This means that at the ideal
        composition (ie the eutectic) a phase transition will occurr at
a single
        temperature where by the solid will go completly liquid.

                Armed with your phase diagram you will also note that
the
        eutectic
        point is formed by the intersection of three lines.  The upper
two line
        are the liquidus lines and the bottom horizontal line is the
solidus
        line.

                So lets put this in perspective.  If you have a eutectic
tin
        lead
        mixture and you place it on top of a bar of lead and you heat
everything
        up past the eutectic point but below the melting point of pure
lead.
        Then
        your reflowing eutectic ball will dissolve lead from the bar
into
        solution
        until the composition reaches the liquidus line at which time
the system
        will essentially be at equillibrium and it will no longer
continue to
        dissolve.  (This is a bit of an aproximation but it is valid for
typical
        reflow times)

                If this doesn't help pick up a reference book on
metalurgy and
        check out the section on brazing or soldering.

                I guess I didn't answer your question.  The answer is
yes the
        two
        will alloy as long as sufficient time and temperature are used.
        Remember
        if you go above the liquidus of both alloys they will mix
readily.
        However if you are somewhere in between the two liquidus
temperatures
        then
        the rate of dissolution will be much slower.  And lastly if the
max
        temperature isn't above the liquidus for the final composition
of the
        two
        alloys then complete mixing will not occurr.

                Some thing are easier to explain in person.

        Good Luck

        Paul  Gill

        Metalurgist at large


        ==============================================================


        [4] Andy Magee Wrote...


        Michael,

        QUESTION: at "normal" soldering iron temperatures, what happens
when you

        melt a eutectic solder preform (p/o clip lead) together with
hi-temp, 90

        to 94% Sn (bal=Pb) solder?
        Will the two solders alloy, or just form a mixture? Please
provide as
        metallurgically correct an answer as possible.

        Generally speaking, they will alloy. Issues that may impact the
result
        are things like:
        melt (mixing) time
        thermal (convection) gradients
        flux activity
        presence of oxides
        presence of copper (intermetallics) from previous reflow cycles

        Andy Magee
        Flex Guru - Consulting
        [log in to unmask]
        (937) 435-3629






        ==============================================================
        ==============================================================
        ==============================================================

        My Original Question was posted as follows....

        On Wed, 25 Nov 1998, Alderete, Michael wrote:

        > Dave Hillman, et al...
        > 1st, Happy Thanksgiving to all on TechNet.
        >
        > QUESTION: at "normal" soldering iron temperatures, what
happens when
        you
        > melt a eutectic solder preform (p/o clip lead) together with
hi-temp,
        90
        > to 94% Sn (bal=Pb) solder?
        > Will the two solders alloy, or just form a mixture? Please
provide as
        > metallurgically correct an answer as possible.
        >
        > Thanks in advance
        >
        > Michael Alderete
        > Aerojet, Azusa (So.) CA
        >
        > ...it's going to be about 80F here tomorrow. Hope you'll still
answer
        > this question on solder mixtures.
        >
        >
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