TECHNET Archives

December 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 Dec 1998 07:36:40 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (70 lines)
Hi Ralph! Add one more vote to the "where did the rosin bad, no clean good
logic hatch?" responses you have received! We build military/commercial
electronics with a high mix of rosin/low residue/no cleaning process
operations that include both ceramic and plastic components with few
problems. I would echo Doug Paul's comments: what is the logic behind your
component engineers decision? They are extremely out of touch with the rest
of the industry.

Dave Hillman
Rockwell Collins
[log in to unmask]





"Vaughan, Ralph H" <[log in to unmask]> on 12/16/98 01:35:14 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Vaughan, Ralph H" <[log in to unmask]>

To:   [log in to unmask]
cc:
Subject:  [TN] plastic parts




Season's Greets,

A query (actually re-query) to those in the know on the usage of plastic
microcircuits instead of ceramics.

I have some component guys who have ruled that plastic parts can only be
assembled on a no-clean flux line.  Anyone using a rosin (RMA) flux is
dis-qualified from assembling for us.  I know the theory is that the
microcracks formed at reflow temperatures will entrap corrosive residues,
but I have trouble buying the NO-CLEAN GOOD, ROSIN-BAD generalization.

Opinions?

Ralph Vaughan
Boeing-Atlanta

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2