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December 1998

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Thu, 17 Dec 1998 00:10:57 -0800
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Chris Otis wrote:
>
> This comes from any undergrad heat transfer book.
>
> Assuming worst case, no heat lost to air or conducted away through the epoxy of
> the board, then
>
> Temp rise = (Power x time)/(mass of copper trace x specific heat of copper)

Give a low steady current to a trace well within
it's limits over a long period of time and this
equation predicts the trace will melt.

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