Fellow Colleagues,

Wondering if someone can tell me the industries stand on reworking inner
layers at black oxide. Would like to get the point of view from both the
PCB manufacturer and end user. I realize that controls need to be in
place so that the layers are not over etched and signal lines are not
reduced, especially for controlled impedance layers. The first time the
boards were oxided they had 40u' of copper etched away and I believe
that by reworking and removing 20-30u' this should not effect the
functionality of the boards.

You comments would be greatly appreciated.

Scott Westhimer

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