Call for Papers
IPC/CCA NATIONAL CONFERENCE ON
BAREBOARD AND ADVANCED SUBSTRATE ELECTRICAL TESTING: HDI'S HOLY GRAIL
May 20-21, 1999 San Jose Hyatt, San Jose, California
The lines are skinny, the pitches are fine, the lands are tiny, and the vias are
microscopic. The printed wiring board is shrinking impressively, but does it work?
Because it defies conventional bed of nails methods, the high tech PWB is turning
substrate electrical test into a kind of "holy grail" in the movement toward system
miniaturization. What will work with blind and buried vias? When is testing
necessary? What is new on the fixtureless and non-contact fronts? IPC and CCA are
sponsoring a national conference to explore these and many other questions.
Technical papers that identify critical, unresolved issues are sought from users and
suppliers of test equipment. Presentations at the conference should be no more than
45 minutes in length. Similar papers may be grouped or presented in a forum or panel
discussion. Topics should address:
· The HDI PWB as test driver
· Handling fine pitch and high density
· Embedded resistors and capacitors
· Fixtureless testers
· Fixture materials
· Standardization progress
· Roadmapping test technology
· High Volume testing
· Effective Designs for testability
· Non-contact solutions
· Test parameters * when not to test?
· Test "traps" in PWB manufacturing?
Papers/presentations must be non-commercial in nature, focusing on technology rather
than a company's product. It is mandatory to provide a print-quality paper and/or
hard copies of visuals for the conference proceedings in order to deliver a
presentation. IPC must receive papers by April 17, 1999.
All technical conference presenters will receive admission to the conference,
including refreshments, lunches and the conference proceedings at no charge.
To submit an abstract: Please send your presentation title and a 200-300 word
description along with your full name, address, phone, fax, e-mail and your brief
biography to John Riley by fax to: 847/509-9798 or by e-mail to: [log in to unmask]
Abstracts are due by February 17, 1999.
Conference Program Committee:
Bryan Franklin, F.C.C., Co-Chair
Fred Karkalik, KAR Technologies, Co-Chair
Duane Delfosse, ECT Circuitest, Inc.
Robert Hanson, Americom Services
Dana Korf, HADCO Santa Clara
Bob Neves, Microtek Laboratories
Maryellen Hilderbrand
Education Manager
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Phone: 847.790.5382
Fax: 847.509.9798
E-mail: [log in to unmask]
URL: http://www.ipc.org
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For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
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