Jim -
To keep it brief, please refer to my paper on "Reflow of Through-hole" off of
my webpage (www.ITM-SMT.com under "Articles").  I have formulas which both Joe
Belmonte (MPM) and I developed independently at our past lives at Motoroal-
Codex and GSS/Array respectively.  I have successfully applied these formulas
using overprint to pitches of .063" ("inspection factor" of approx. 7.5).  I
believe using overprint and the solder preforms available from Indium in the
shape of .0805s that can be pick and placed into the overprinted solder paste,
you will have no trouble producing a positive fillet on both sides
("inspection factor" of 1.0).
Regards,
Phil Zarrow
ITM Inc.
Durham, NH  USA
www.ITM-SMT.com

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################