CALL FOR PAPERS
IPC Chip Scale and BGA National Symposium
Santa Clara Convention Center, Santa Clara, CA
Workshops: May 5, 1999
Tabletop Exhibits/Technical Conference: May 6 & 7, 1999
Across the world, semiconductors are "following the leadless." Chip scale ball grid
array packages provide a high density, thermally and electrically sound, space
efficient solution for a growing number of component devices. If CSP is here to stay,
then what changes are in store for the rest of the electronic interconnection
industry? With so many CSP configurations available, what design, manufacturing and
assembly guidelines are needed?
For five consecutive years, IPC has dedicated national conferences to the exploration
of advanced component packaging. This year's event will have a special emphasis on
reliability studies and new applications. Papers and workshops are sought on BGA, CSP
and associated assembly and board-level issues.
May 5 will be devoted to full and half day workshops. The technical conference on May
6-7 will include tabletop exhibits.* Presentations at the conference must be no more
than forty-five minutes in length. Workshops must be either half day (three hours) or
full day (seven hours). Topics should address:
· Package designs
· Product applications
· Assembly processes
· Solder joint reliability
· Test methodology
· Wafer level fabrication
· Die attach, encapsulation materials
· HDI substrates for CSP
· PCB design considerations
· Standardization progress
Paper/presentations must be non-commercial in nature, focusing on technology rather
than a company's product. It is mandatory to provide a print-quality paper and/or
hard copies of visuals for the conference proceedings in order to deliver a
presentation. The deadline for presentation or workshop materials submission is April
2, 1999.
All technical conference presenters will receive admission to the conference and the
exhibits, including refreshments, lunches and the conference proceedings at no
charge. Workshop presenters will receive an honorarium and expenses.
To submit an abstract: Please send your presentation/workshop title and a 200-300
word description along with your full name, address, phone, fax, e-mail and a brief
biography to John Riley by fax to: 847/509-9798 or by e-mail to: [log in to unmask]
Abstracts are due by January 29, 1999. Please indicate if the submission is for the
technical program or a workshop.
*If your company is interested in exhibiting at the IPC Chip Scale Ball Grid Array
National Symposium, please contact Page Hecker at 510-797-5517. The tabletop exhibit
fee of $650 includes admission for one person to the Technical Conference.
Maryellen Hilderbrand
Education Manager
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Phone: 847.790.5382
Fax: 847.509.9798
E-mail: [log in to unmask]
URL: http://www.ipc.org
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For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
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