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December 1998

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Subject:
From:
Charles Barker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Dec 1998 16:25:11 -0600
Content-Type:
text/plain
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We are investigating the purchase of an automated inspection system.
The system must be able to do 3D solder pste deposition inspection,
component post and pre-reflow inspection, as well as solder joint
post-reflow and post-wave inspection.

We are presently looking at systems from MVP, Omron and General Scanning.
The first two are leading the pack.

Does anyone have experience with any of these? Please send me your
evaluations.
Any other candidates to investigate?

To avoid airing any disparaging remarks to the whole world, please respond
directly to me at:
[log in to unmask]
281-552-3328

TIA,
Charlie B.

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